The wafer batter is produced in batches, transferred to the batter depositing station of the automatic wafer baking machine and poured onto the baking plates.
The wafer sheets are baked in accordance with the baking time and baking temperature, then removed automatically and transferred to the further processing production line. The wafer sheets are conveyed over a wafer sheet cooler to cool them down before they reach the wafer spreading machine. The cream for wafer filling is also produced in batches and fed into the cream hopper of the spreader head. The cream filling is applied in fully automatic mode. The wafer sheets stacked on top of one another according to the preset number, the top sheets are put on and afterwards the wafer books are calibrated to the thickness desired.