This is a compact version of wafer cutting and mini distribution.The cut wafer biscuit move directly and immediately from the cutting machine on to a conveyor with limited distribution.Once the wafer biscuits are separated side to side, the conveyor carries the spread wafer biscuit forward on to chocolate coating line
Conveyor (A) - Horizontal separation by strips guides.
Conveyor (B) - Vertical separation by inventor controlled belt speed.
The WFD - II
Consists of standard machines
1. Conveyor (A) & (B)
2. WC 4 - Wafer Cutting Machine
1. Outfeed cutting frame with divider guides suitable for each cut size can be ordered separately.