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Wafer Machine - Semi Automatic- ZW-Wafer Biscuit Cutting Chart  

ZW :Wafer Baking Plants Plate Size : 230x290
No.
Chart for making a cut selection of wafers.


 
1.
Sheet Size
230

290
2.
Minimum Trimmings the book (1.5mm per side)**
2

2
3.
Size available for cutting 228

288
4.
Resultanat Size***+/- 1mm

mm
Cuts
mm


113 2 143


75.0 3 95.0
    56.0 4
71.0
    44.6 5 56.6
    37.0 6 47.0
    31.6 7 40.1
    27.5 8 35.0
    24.3 9 31.0
    21.8 10 27.8
    19.7 11 25.2
    18.0 12 23.0
    16.5 13 21.2
    15.3 14

19.6



Note:
1. ** This is an indicative size only .Preferably 5mm
2. ***Deduct -1mm to accomodate for the cutting wire waste
3. Please allow for shrinkage immediately after baking
4. The wafer product has a tendency to expand 1% after keeping




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