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Wafer Machine - Semi Automatic- ZW-Wafer Biscuit Cutting Chart
 
ZW :Wafer Baking Plants Plate Size : 230x290
No.
Chart for making a cut selection of wafers.
L1

L2
1.
Sheet Size
230

290
2.
Minimum Trimmings the book (1.5mm per side)**
2

2
3.
Size available for cutting 228

288
4.
Resultanat Size***+/- 1mm

mm
Cuts
mm


113 2 143


75 3 95
    56 4
71
    45 5 57
    37 6 47
    32 7 40
    28 8 35
    24 9 31
    22 10 28
    20 11 25
    18 12 23
    17 13 21
    15 14

20



Note:
1. ***Deduct -1mm to accomodate for the cutting wire waste
2.*There may be shrinkage first , and expansion of wafer sheet on storage(1%)


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