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Wafer Machine -
Semi Automatic- ZW-Wafer Biscuit Cutting Chart
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| ZW :Wafer Baking Plants Plate Size : 230x290 |
No.
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Chart for making a cut selection of wafers.
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1.
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Sheet Size
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230
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290 |
2.
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Minimum Trimmings the book (1.5mm per side)**
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2
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2 |
3.
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Size available for cutting
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228
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288 |
4.
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Resultanat Size***+/- 1mm
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mm
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Cuts
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mm
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113 |
2 |
143 |
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75.0 |
3 |
95.0 |
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56.0 |
4
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71.0 |
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44.6 |
5 |
56.6 |
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37.0 |
6 |
47.0 |
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31.6 |
7 |
40.1 |
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27.5 |
8 |
35.0 |
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24.3 |
9 |
31.0 |
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21.8 |
10 |
27.8 |
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19.7 |
11 |
25.2 |
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18.0 |
12 |
23.0 |
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16.5 |
13 |
21.2 |
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15.3 |
14 |
19.6 |
Note:
1. ** This is an indicative size only .Preferably 5mm
2. ***Deduct -1mm to accomodate for the cutting wire waste
3. Please allow for shrinkage immediately after baking
4. The wafer product has a tendency to expand 1% after keeping

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