Wafer Cutting Apparatus - (WCM)
Wafer Turning Device
The wire cutting machine "WCM" is manually operated and cuts wafer blocks to small wafer fingers of predetermined dimensions. The cutter frame and feed bar can be exchanged to produce other size of biscuits. The machine is used for cutting of small scale output.

  • Technical Specifications

  • s
    Copyright © 2020 - All rights reserved.