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Wafer Machine - ' ZWA ' Series Semi Automatic Wafer Baking Machine :-

'ZWA’ SERIES AUTOMATIC WAFER BAKING MACHINES
The automatic wafer baking machines of the ZWA series are suitable for the production of first class quality flat wafers. These machines can be Equipped with 12, 18, 24 30 & 36 baking plates(tongs) according to the required output. The machine is built with a steel frame of rigid construction. An endless chain conveys the baking plates on their carriers through the baking chamber driven by a chain drive infinitely variable in speed through its range.
The standard size of the baking plates is 290mm x 460mm (about 11 ½” x 18”). Also, special size of baking plates can be supplied on request. These baking plates can easily be exchanged to produce wafers of different designs. The oven can be heated by L.P.Gas or if preferred by Electricity.

Batter
Wheat flour, Maize starch, Vegetable fat, preservatives etc are mixed with water to form the wafer batter. The batter is discharged onto the baking plates by a cam operated pump. The pump can be very accurately set to give an efficient distribution of batter with maximum economy and minimum wastage. Adjustment, clearing and maintenance of the pump is simple and quick.

Baking Plates

The plates are made of special alloy. The selection of alloy and casting procedure ensures dimensional stability, a homogenous and dense surface, thermal stability, good heat accumulation characteristics and excellent thermal conductivity. Special finishing is done to ensure trouble free release of wafer sheets. The wafer thickness is quickly and easily adjusted by applying spacing shims.


Heating (either by liquified petroleum gas or electricity)

The gas heating system has automatic ignition with safety devices. In the case of gas, air or power failure, a automatic cutout device on the heating system will operate. The oven is equipped with special burners. Precise controls for the mixture of gas and air gives high efficiency combustion. On gas heated machines, the exterior of baking plates have pyramidal shapes cast-on, to give increased surface area and thus better heat exchange.


Feeding and Sheet Take-Off

The batter is discharged onto the baking plates by a cam operated pumps. The precision-built pump gives an efficient distribution of batter. Air blowing facility for simple removal of the wafer sheet from the baking plates.

Drive and Controls
The control panel can be mounted at the discharge end of the oven or at a distance of upto one meter for ease of operation. This provides control for the drive, batter pump, blowers and ignition. The drive is by an electric motor through a gear box and chain drive protected by an overload safety clutch. Baking time is adjustable between 1.5 and 3 minutes by means of potentiometer on the control panel, provided suitable batter is used.

Process Chart

1. Automatic Wafer Oven   2. Batter Mixer  3. Planetary Cream Mixer  4. Cream Spreading M/C. 5. Wafer Cutting M/C  6. Packing Machine 
 7. Sheet removal and Stress Reliever 

Technical specifications

TYPE ZWA12 ZWA18 ZWA24 ZWA30 ZWA36
No. of Baking Plates (tongs)

12

18

24 30 36
Output of Wafer Sheets/Hr.* 360 640 860 1080 1300
Cream filled with Wafer Biscuits in Kg/Hr* 40-42
Kgs
72-75
Kgs
96-100
Kgs
120-125
Kgs
145-150
Kgs
GAS HEATING           
L.P.Gas Consumption Kgs/hr (approx)** 8 10-12 14-16 18-20 20-23
Electric load in Kw 3.5 3.5 3.5 3.5 3.5
ELECTRIC HEATING          
Load in KW 52 76 100 124 148
Consumption in KW/Hr** (approx) 40 57 75 94 110
DIMENSIONS IN MM          
Length 4,250 5,750 7,250 8,750 10,250
Width 1,500 1,500 1,500 1,500 1,500
Height 2,000 2,000 2,000 2,000 2,000
WEIGHT & SHIPPING DETAILS          
Net Weight in Kg. (approx.) 3,500 5,500 7,000 8,500 10,000
Including export packing kg. (approx.) 4,500 6,750 8,500 10,000 12,500
Shipping Space in Cubic Metres (approx.) 20 25 30 36 42


 

 

 

 

 

 

 

 

 

 


* It may vary depending on the recipe, batter consistency, cream ratio, etc.

** The above details are approximate figures obtained under working conditions and vary according to the thickness of the wafer sheet and consistency of the batter.

*** Because of the low number of baking plates, longer baking times are necessary.

NOTE: We are constantly guided by our principle of offering our customers better and better machines; to give increased efficiency and higher levels of automation.
The technical data and illustrations are subject to charge with notice.

Output Details 

The output is dependent on the following factors
  • The sheet weight
  • The baking time or cycle
  • The cream ratio of wafer and cream
A Wafer Sheet Details Size 290X460
Baking Time Plant Type

ZWA18

ZWA24

ZWA30

ZWA36

Wafer Sheets produced/hour
90 Seconds 720 960 1200 1440
120 Seconds 540 720    900 1080
180 Seconds 360 480 600 720
B Output Details Each Kgs Kgs Kgs Kgs
I Baking Cycle taken at 90 sec
1 Weight of wafer sheet/hour 50g 36 48 60 72
2 Wafer Cream Ratio 1:1.5 54 72 90 108
Total Production/hour 90 120 150 180
II Baking Cycle taken at 120 sec
1 Weight of wafer sheet/hour 50g 27 36 45 54
2 Wafer Cream Ratio 1:1.5 40.5 54 67.5 81
Total Production/hour 67.5 90 112.5 135

 

 

 

 

 

 

 

 

 

 

*NOTE: We are constantly guided by our principle of offering our customers better machines in order to provide increased efficiency and higher levels of automation.
The technical data and illustrations are subject to change without notice.

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