WAFER CUTTING DEVICE
These machine take
over the cooled-down wafer blocks coming from the cooling device or
creaming machine and cut them into required number of blocks. These
are used for cutting flat and Hollow Wafers filled with cream.
Wafer Cutting Apparatus (WCM)
WAFER CREAMING MACHINE
Spreading Machines can apply a wide range of creams to all these kinds of wafer sheets. Normally these machines operate on the contact system but can also be supplied with an additional device for creaming by the film system.
These are used for
the efficient cooling and stress-relieving in the ambient air due to constant dwell period of the sheets in the machine.
cooler is a machine used for cooling the
cream between the wafer books before they enter the cutting machine. The cooling capacity can be changed according to the product requirement & capacity required.
large scale production when many wafer
machines must be installed in an existing
production area, or in to an existing production line a layout is required, in which the length and breadth of the wafer can be inter changed this facilitates the orientation of wafer sheet to the correct layout for the next process.