| Chart for making a cut selection of wafers. | L1 | L2 | |
| Wafer Die Size(in mm)* | 270 | 370 | |
| Trimmings the book / Each side | 3 | 3 | |
| Size available for cutting | 264 | 364 | |
| Resultanat Size***+/- 1mm | mm | Cuts | mm |
| 131 | 2 | 181 | |
| 87.0 | 3 | 120.3 | |
| 65.0 | 4 | 90.0 | |
| 51.8 | 5 | 71.8 | |
| 43.0 | 6 | 59.7 | |
| 36.7 | 7 | 51.0 | |
| 32.0 | 8 | 44.5 | |
| 28.3 | 9 | 39.4 | |
| 25.4 | 10 | 35.4 | |
| 23.0 | 11 | 32.1 | |
| 21.0 | 12 | 29.3 | |
| 19.3 | 13 | 27.0 | |
| 17.9 | 14 | 25.0 | |
| 16.6 | 15 | 23.3 | |
| 29.1 | 16 | 29.1 | |
| 27.4 | 17 | 20.3 |
