These machine take over the cooled-down wafer blocks coming from the cooling device or creaming machine and cut them into required number of blocks. These are used for cutting flat and the Hollow Wafers filled with cream. In the cutting operation the first cut is made through the width of the stack, and the second cut is a longitudinal one. Fixed and tensioned cutting wires in removable frames are used to cut the wafers. Changeover to other cutting sizes is facilitate by quickly by easily changing the cutting frames and pushers.