 |
|
|
|
|
| Wafer Machine -
Automatic- ZWT-Wafer Biscuit Cutting Chart |
 |
| ZWT :Wafer Baking Plants Plate Size : 270x370 |
No.
|
Chart for making a cut selection of wafers.
|
L1
|
|
L2 |
1.
|
Wafer Die Size(in mm)* |
270
|
|
370 |
2.
|
Trimmings the book (min.1.5mm per side)**
|
3
|
|
3 |
3.
|
Size available for cutting |
264 |
|
364 |
4.
|
Resultanat Size***+/- 1mm
|
mm
|
Cuts
|
mm |
|
|
131
|
2 |
181 |
|
|
87
|
3 |
120 |
| |
|
65
|
4
|
90 |
| |
|
52 |
5 |
72 |
| |
|
43 |
6 |
60 |
| |
|
37 |
7 |
51 |
| |
|
32 |
8 |
45 |
| |
|
28 |
9 |
39 |
| |
|
25 |
10 |
35 |
| |
|
23 |
11 |
32 |
| |
|
21 |
12 |
29 |
| |
|
19 |
13 |
27 |
| |
|
18 |
14 |
25 |
| |
|
17 |
15 |
23 |
| |
|
|
|
|
Note:
1. ***Deduct -1mm to accomodate for the cutting wire waste
|
|
|
| R&D Engineers Hyderabad , India Telephone No +91 40 2340 2682 © 2011-12 R&D Engineers |
