Products-Supporting Equipment

Wafer Cutting Apparatus - (WCM)

WCM Machine

Thee wire cutting machine "WCM" is manually operated and cuts wafer blocks to
small wafer fingers of predetermined dimensions. The cutter frame and feed bar
can be exchanged to produce other size of biscuits. The machine is used for
cutting of small scale output.

Technical Data

Machine Variables	WCM
Size of the Wafer sheet (in mm apprx)	270 X 370
Dimensions (approx)
Length	1450
Width	1130
Height	675
Weight (approx)
Net	130
Gross	200
Shipping Volume(CBM)	1.2 m³

S.No.	Wafer Biscuit Cutting Size
1.	Size of Wafer 270X370

Note
We are constantly guided by our principle of offering our customers better and better machines; to give increased efficiency and higher levels of automation. The technical data and illustrations are subject to change without notice