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Wafer Cutting Apparatus - (WCM)

 

WCM Machine

Thee wire cutting machine "WCM" is manually operated and cuts wafer blocks to
small wafer fingers of predetermined dimensions. The cutter frame and feed bar
can be exchanged to produce other size of biscuits. The machine is used for
cutting of small scale output.

Technical Data

Machine Variables WCM
Size of the Wafer sheet (in mm apprx) 275 X 375
Dimensions (approx)
Length 1450
Width 1130
Height 675
Weight (approx)  
Net 130
Gross 200
Shipping Volume(CBM) 1.2

S.No. Wafer Biscuit Cutting Size
1. Size of Wafer 270X370

Note
We are constantly guided by our principle of offering our customers better and better machines; to give increased efficiency and higher levels of automation. The technical data and illustrations are subject to change without notice

    
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